AZ® BARLi® - II
AZ® BARLi® - II is a bottom anti-reflective layer coating for use on highly reflective surfaces in the semiconductor industry. It is designed to work with positive photoresists and is optimized for i-line exposure tools. Upon completion of the lithographic process, AZ® BARLi® - II is patterned in a dry-etch process.
Omni Coat
HMDS (hexamethyldisilazane)
Process used for producing a 1-monolayer thick sticking layer on a surface prior to lithography.
ProTek®
This is a protective coating process that enables simple, effective wet-etching processes for silicon, compound semiconductors, and glass.
Brewer Science® ProTEK® website
Surpass 3000
A Cationic Priming Agent designed and formulated for use with photoresist on silicon, glass, nickel, gallium arsenate, indium tin oxide, and various other metallic and non-metallic substrates.
Visit DisChem Inc. for the Technical Data Sheet
Surpass 4000
A Cationic Priming Agent designed and formulated for use with photoresist on silicon, glass, nickel, gallium arsenate, indium tin oxide, and various other metallic and non-metallic substrates.
Visit DisChem Inc. for the Technical Data Sheet