Thermal

Thermal analysis at MCL includes thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and simultaneous differential thermal analysis (SDT), which are thermal analysis techniques used to characterize how materials respond to a controlled temperature program.

  • TGA measures changes in sample mass as a function of temperature or time, providinginformation on thermal stability, decomposition temperatures, oxidation or reductionbehavior, moisture, or solvent content.
  • DSC measures the heat flow associated with thermal transitions in a material, yieldingquantitative information on endothermic and exothermic events such as melting,crystallization, glass transitions, curing reactions, phase changes, and heat capacity.
  • SDT instruments combine TGA and DSC (or DTA) measurements in a single experiment onthe same sample, allowing direct correlation between mass changes and thermal events;this is particularly valuable for distinguishing physical transitions from chemically drivenprocesses such as decomposition or oxidation. Together, these techniques offercomplementary insights into composition–structure–property relationships, reactionenergetics, and thermal performance of materials across polymers, catalysts,pharmaceuticals, and inorganic solids.

In addition to standard TGA, hyphenated measurements can be performed using Mass
spectrometry (MS)allowing to characterize the evolved gas during the thermal decomposition.

Technique Data Obtained Applications
Thermogravimetric Analysis (TGA) Weight change with temperature.
Weight loss/gain in mg and %
Thermal and oxidative stability of
materials from room temperature to
1000 °C under nitrogen or air (other
gases can be discussed)
Differential Scanning Calorimetry
(DSC)
Heat flow changes with temperature.
Heat flow in W/g
Melting, crystallization and glass
transition temperatures from -120 °C
to 400 °C under nitrogen.
Material decomposition must be
below 1wt% over the temperature
range of interest.
Simultaneous DSC/TGA (SDT) Combined heat flow and weight
loss/gain as a function of
temperature.
Same as TGA and DSC with TGA
capabilities from room temperature to
1,500°C and heat flow capabilities
from 200 to 1,500°C under nitrogen
Thermogravimetric Analysis Coupled
Mass Spectrometry (TGA-MS)
Evolved Gas Analysis:
- mass-to-charge ratio (m/z up to 300
amu) of evolved gaseous products.
Identification of degradation
products, residual solvents and
contaminants from room temperature
to 1000 °C under nitrogen or air.
Thermal Lab
MCL Thermal Analysis

The Thermal Lab Suite

Image of TGA 550
Discovery TGA 550

TGA chart

Image of Discovery SDT 650
Discovery SDT 650

Figure demonstrating simultaneous DSC and TGA

Image of Discovery DSC 2500
Discovery DSC 2500

The following thermal instruments are available at MCL:  

  • TGA: Discovery TGA 550 with autoloader (TA Instruments) RT-1,000
  • DSC: Discovery DSC 2500 with autoloader (TA Instruments) -120-400°C
  • SDT: Discovery SDT 650 with autoloader (TA Instruments) RT-1,450°C
  • TGA MS: Discovery TGA 5500 coupled with Discovery MS (TA Instruments) RT-1,000°
Instrument Discovery TGA 550 Discovery TGA-MS Discovery DSC 2500 Discovery SDT 650
Technique Dedicated TGA TGA and EGA Dedicated DSC Simultaneous TGA and DSC
Temp. Range (°C) 25 to 1,000°C   25 to 1,000°C -120 to 400°C 25 to 1,450°C
Gas Atmosphere Nitrogen and air (CO₂ for adsorption) Nitrogen and air (CO₂ for adsorption) Nitrogen Nitrogen
Sample Crucible Type Platinum (Pt pan), Aluminum (Al pan), Alumina (Al₂O₃ pan) Platinum (Pt pan), Aluminum (Al pan), Alumina (Al₂O₃ pan) Aluminium (T-zero hermetic and non-hermetic) Alumina (85)
Platinum (85)
Typical Sample Size (mg) 1 to 10mg (up to 100mg for residual solvent) 1 to 10mg 1 to 10mg 1 to 10mg
Additional Features

High resolution TGA (Hi-Res™ TGA) 

Modulated TGA (MTGA™)

Hi-Res™ TGA

MTGA™

MS: up to 300 amu

Modulated DSC Capability (MDSC®)

Hi-Res TGA™

MTGA™

MDSC®