Penn State leads semiconductor packaging, heterogeneous integration center (JUMP 2.0)

Image of a semiconductor chip in a motherboard

By Ashley WennersHerron

UNIVERSITY PARK, Pa. — The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA), has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).

NSF grant expands materials science research at Penn State Behrend

woman posing in a lab

ERIE, Pa. — A $385,000 grant from the National Science Foundation will fund the purchase of an Instron drop tower impact-testing system at Penn State Behrend, where faculty members are developing new approaches to polymer recycling and the formulation of new composites.

At least 10 faculty members will use the system to advance their research, which includes automotive and aerospace partnerships. Another will use it to test new polymers for ski boots and bindings.

New method can scale, simplify manufacture of stretchy semiconductors

Image of a stretchy transistor illuminated from above

By Mariah R. Lucas

UNIVERSITY PARK, Pa. — Soft, elastic semiconductors and circuits could advance wearable medical devices and other emerging technologies, but the high-performance electronics are difficult and expensive to manufacture. A Penn State-led research team plans to make the process easier and cheaper with a new manufacturing method.

They published their approach Nov. 28 in Nature Electronics.