People viewing a poster during a research poster session in a large room
Event lifts curtain on a bright future for materials research

By Jamie Oberdick

UNIVERSITY PARK, Pa. — You are reading this because of materials.  

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Image of a semiconductor chip in a motherboard
Penn State leads semiconductor packaging, heterogeneous integration center (JUMP 2.0)

By Ashley WennersHerron

UNIVERSITY PARK, Pa. — The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced…

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Researchers in the nanofab
Q&A: The CHIPS Act and strengthening the US workforce

By Adrienne Berard

President Joe Biden recently signed into law the CHIPS and Science Act, a $280 billion package to support domestic semiconductor manufacturing capabilities and increase research and development in the sector…

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