$3M grant targets integrated semiconductor for smarter, greener electronics
By Jamie Oberdick
The microelectronics industry is nearing a tipping point. The silicon chips at the heart of everyday electronic devices are running into performance limits, raising the need for new materials and technologies to continue making faster, more efficient devices.
The search to replace a critical semiconductor
China recently limited the export of gallium nitride, a type of semiconductor used to manufacture a variety of consumer power electronics, such as cellphones and computers, as well as medical devices, cars, wind turbines, solar farms, LED lightbulbs and more.
$2M NSF Future of Semiconductors grant to team led by Penn State researchers
UNIVERSITY PARK, Pa. — In an increasingly digital world, semiconductors or “chips” serve as foundational building blocks for everything from smartphones to supercomputers. The U.S.
Q&A: How can advanced chip packaging help redesign the future of semiconductors?
Researchers explain how chip architecture and Penn State-led initiatives can help jump-start U.S. chip manufacturing
By Tim Schley
The phrase “advanced chip packaging” might conjure images of a fancy Pringles can. For those who manufacture semiconductors — also known as integrated circuits, chips or microchips — it represents a new frontier, a race to design and mass produce the next generation of semiconductors that use less energy while delivering more computing power.
‘Surprising’ hidden activity of semiconductor material spotted by researchers
By Jamie Oberdick
New research suggests that materials commonly overlooked in computer chip design actually play an important role in information processing, a discovery which could lead to faster and more efficient electronics. Using advanced imaging techniques, an international team led by Penn State researchers found that the material that a semiconductor chip device is built on, called the substrate, responds to changes in electricity much like the semiconductor on top of it.
Silicon Carbide Innovation Alliance to drive industrial-scale semiconductor work
By Jamie Oberdick
Known for its ability to withstand extreme environments and high voltages, silicon carbide (SiC) is a semiconducting material made up of silicon and carbon atoms arranged into crystals that is increasingly becoming essential to modern technologies like electric vehicles, renewable energy systems, telecommunications infrastructure and microelectronics.
Integrating dimensions to get more out of Moore’s Law and advance electronics
By Jamie Oberdick and Ashley WennersHerron
Moore's Law, a fundamental scaling principle for electronic devices, forecasts that the number of transistors on a chip will double every two years, ensuring more computing power — but a limit exists.
Today's most advanced chips house nearly 50 billion transistors within a space no larger than your thumbnail. The task of cramming even more transistors into that confined area has become more and more difficult, according to Penn State researchers.
Electrical control of quantum phenomenon could improve future electronic devices
For the first time, researchers demonstrate how to electronically alter the direction of electron flow in promising materials for quantum computing
By Gail McCormick
Ceramics & Glass: A new vision for ancient materials
By Jamie Oberdick
Ceramics and glass are two materials that have been around since ancient times, yet many people outside of materials science are unaware of the impact they have on their lives beyond the obvious.