Electronics and Devices

Researchers explain how chip architecture and Penn State-led initiatives can help jump-start U.S. chip manufacturing

By Tim Schley

The phrase “advanced chip packaging” might conjure images of a fancy Pringles can. For those who manufacture semiconductors — also known as integrated circuits, chips or microchips — it represents a new frontier, a race to design and mass produce the next generation of semiconductors that use less energy while delivering more computing power.

By Jamie Oberdick

Systems in the Universe trend toward disorder, with only applied energy keeping the chaos at bay. The concept is called entropy, and examples can be found everywhere: ice melting, campfire burning, water boiling. Zentropy theory, however, adds another level to the mix.  

By Ashley WennersHerron

There’s a barrier preventing the advent of truly elastic electronic systems, the kind needed for advanced human-machine interfaces, artificial skins, smart health care and more, but a Penn State-led research team may have found a way to stretch around it. 

By Jamie Oberdick

Researchers from the National Science Foundation-sponsored Two-Dimensional Crystal Consortium (2DCC-MIP) - Materials Innovation Platform may have come up with a solution for a bottleneck that has confounded researchers trying to develop high-quality 2D semiconductors for next generation electronics such as Internet of Things (IoT) and artificial intelligence.  

By Matthew Carroll

Next-generation electronics will feature smaller and more powerful components that require new solutions for cooling. A new thermoelectric cooler developed by Penn State scientists greatly improves the cooling power and efficiency compared to current commercial thermoelectric units and may help control heat in future high-power electronics, the researchers said.

By Ashley WennersHerron